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Strategic MoU between Terminus Circuits and Kaynes Semicon
Kaynes Semicon & Terminus Circuits Pvt Ltd Sign Strategic MoU at India Electronics and Semiconductor Association Vision Summit 2026...
Kaynes Semicon is pleased to announce the signing of a Memorandum of Understanding (MoU) with Terminus Circuits Pvt Ltd at the IESA Vision Summit 2026, Bangalore. The MoU was formally exchanged by Mr. Raghu Panicker, CEO – Kaynes Semicon, and Mr. Sankar Reddy, CEO - Terminus Circuits Pvt Ltd, marking the beginning of a strategic collaboration between the two organizations.
This MoU launches India’s move toward component-level sovereignty for high‑speed interface ASICs, subsystems and products for domestic and global markets. By combining each company’s strengths, it enables end-to-end ASIC-level solutions and contributes to system building for HPC, AI, and 5G‑and‑beyond applications.
Kaynes Semicon is pleased to announce the signing of a Memorandum of Understanding (MoU) with Terminus Circuits Pvt Ltd at the IESA Vision Summit 2026, Bangalore. The MoU was formally exchanged by Mr. Raghu Panicker, CEO – Kaynes Semicon, and Mr. Sankar Reddy, CEO - Terminus Circuits Pvt Ltd, marking the beginning of a strategic collaboration between the two organizations.
This MoU launches India’s move toward component-level sovereignty for high‑speed interface ASICs, subsystems and products for domestic and global markets. By combining each company’s strengths, it enables end-to-end ASIC-level solutions and contributes to system building for HPC, AI, and 5G‑and‑beyond applications.
